Apple today declared M1 Extremely, another huge leap for Apple silicon as well as the Mac. That includes UltraFusion — Apple’s ground breaking packaging architecture that interconnects the die of two M1 Max chips to produce a program over a chip (SoC) with unparalleled levels of functionality and capabilities — https://en.shivira.com/at-an-apple-aapl-event-the-m1-ultra-processor-and-new-products-were-shown/